Supports high-density packaging and
Miniature 1.27mm pitch connector
● Two columns with a contact spacing of 1.27mm can be packaged with high density.
● The connection with the substrate is configured in four columns (1.27mm × 1.905mm).
● Adopt sheet contact structure, excellent pry resistance and smooth insertion and extraction.
● The occlusal length is 3.1mm, which has more room.
● excellent design of the pressing part can maintain stable contact force.
By using palladium plating contacts, the contact reliability is further improved.
● standard configuration full pole fixed pin to prevent floating and falling during welding.
● screws can also be used to fix the substrate.
● unable to engage with the XH3/XH4 half-pitch connector.
OMRON XH2: Series
OMRON XH2 series: half-pitch connector (with lugs for substrate-to-substrate connection) (socket) – XH2B-8042-A
$14.00
Half spacing connector (with lugs for substrate-to-substrate connection),Sub-series: XH2B DIP L-type terminal,Number of Poles: 80 poles,Terminal shape: DIP L type,Pitch: 1.27mm,With fixing pin
Availability: 8888 in stock


