1.27mm pitch connector corresponding to surface encapsulation
• Surface packaging products that can encapsulate parts on the back of the substrate.
• Positioning axes can be used to accurately mount components on the substrate.
• Backflow welding is supported.
• Can correspond to various pole numbers and substrate connection directions (vertical, horizontal, stacked) and
The height between the substrates during stacking connection can correspond to 8~18.5mm, which is helpful.
Improve design freedom.
• Equipped with a fixed part through-hole reflow soldering type structure (THR
Type).
• Equipped with socket for crimping, you can freely process wire harness on site.
At the same time, wiring harness can also be standard.
OMRON XH5-N: Series
OMRON XH5-N series: half-pitch connector SMT type (substrate-to-substrate/substrate-to-cable) (socket) – XH5B-2016-4N
$8.00
Half-pitch connector SMT type (for substrate-to-substrate/substrate-to-cable connection),Sub-series: XH5B socket straight (terminal SMT/fixed THR type),Number of Poles: 20 poles,Shape: Straight,Terminal part: SMT,Fixed part: THR,Pitch: 1.27mm,Height: 6.25mm
Availability: 8888 in stock
